MEMS Assembly
Micralyne utilizes a variety of
MEMS technologies to assemble and package a wide range of customer products. From
MEMS bioanalytical and commercial printing component assemblies to
MEMS optical component subassemblies, Micralyne has the expertise, experience and tool-set to successfully assemble most
MEMS-based products.
MEMS assembly capabilities include:
| Wire Bonding |
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High speed automatic wedge Aluminum/Gold deep access
wire bonding equipped with PRS
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Wire size capability from 17 - 75 microns
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Substrate size up to 200 mm X 150 mm
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Position repeatability +/- 3 microns typically
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Multi-chip, multi-module wire bonding capability
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Wire bonding capability from dice to package and dice to sub-mount
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Packaging capabilities include flex cables, mounting substrates, packages compatible with optical technologies
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| Dicing |
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Standard silicon dicing 4” & 6” |
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Quartz dicing
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Standard glass dicing up to 6”
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Silicon/Glass stacked dicing
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Glass/Glass stacked dicing
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Alumina dicing
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Micralyne also offers other customized MEMS assembly capabilities. Please contact us for more information.
MEMS Testing
Micralyne employs its OEM experience to build and configure final product and testing instrumentation; ensuring customer requirements have been met.
Micralyne provides customer configuration of
MEMS product assemblies and implements custom testing systems unique to each customer. Micralyne also offers in house process engineering services for the development and improvement of
MEMS assembly and test processes. This maximizes yields and efficiency enabling a lower cost & higher quality product.
| MEMS Test & Characterization Capabilities |
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SEM (Scanning Electron Microscope) with x-ray analysis
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Thin film stress measurement with thermal cycling capability
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Line width measurement
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Sheet resistance measurement
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Optical profiler using white light interferometry
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Surface profilers
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Film thickness measurements
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CV measurements
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Wire bond pull test
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Electrical test – probe station
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Automated visual inspection |
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Real time measure and data acquisition
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