MEMS Capabilities List
SCD Track - Coat Resists, Soft Bakes, & Develops MEMS Wafers
Micralyne has a number of expert MEMS capabilities for the microfabrication, packaging, assembly and characterization of MEMS devices it supplies for its customers. MEMS Capabilities include:
MEMS Lithography
- Mask aligners with contact, proximity & vacuum mode
- Back to front alignment capability using IR and optics
- Cassette to cassette loading
- Tracks for automatic coating/developing
- Manual coaters and developers
MEMS Metal deposition
- Thin film sputtering (3 targets)
- E-beam evaporation (6 pockets)
- Thin film coatings
- Dielectrics and metals
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MEMS Plasma deposition
- Batch top PECVD (oxide/nitride/oxynitride/amorphous silicon)
- Dual wafer load lock system
- Dual frequency capability of oxide and nitride
MEMS Plasma etching
- Batch top etching of nitride and oxide
- Cassette to cassette oxide etchers
MEMS Deep Reactive Ion Etching
- Bosch DRIE process (cassette to cassette)
- Cryo process
Furnaces
- Pyrogenic thermal oxidation
- Annealing
MEMS Wet etching
- Anistotropic etching of silicon, dielectrics, metal films, glass
MEMS Electroplating
- AuSn solder alloy up to 60 mm
- Au plating
Bonding
- Glass-glass fusion bonding
- Silicon-silicon fusion bonding
- Glass-silicon anodic bonding
- AuSn solder eutectic bonding
MEMS Substrates
- 4” or 6” silicon, SOI and 8″ MEMS
- 4” or 6” (round or square) Glass
- Miscellaneous substrates of odd sizes
Dicing
- Standard silicon and glass dicing
- Quartz and alumina dicing
- Silicon-glass stacked dicing
- Glass-glass stacked dicing
Wire Bonding
- Manual and automated wire bonding
(dies to package, dies to submount, flex cables) - High-speed automatic wedge Al/Au
MEMS Characterization
- SEM (Scanning Electron Microscope) with x-ray analysis
- Thin film stress measurement with thermal cycling capability
- Line width measurement
- Sheet resistance measurement
- Optical profiler using white light interferometer
- Surface profilers
- Film thickness measurements
- CV measurements
- Wire bond pull test
- Electrical test – probe station
- Real time measure and data acquisition
Read more details about MEMS Assembly & Test at Micralyne.