MEMS Development / MEMS Manufacturing

Micromachining

Micromachined MEMS Comb Drive
Micromachined MEMS Comb Drive
Micralyne has been involved in MEMS micromachining for over 20 years. The micromachining of MEMS involves the selective etching of silicon, glass, and deposited thin films to form three dimensional mechanical structures such as cantilevers, diaphragms, and channels. The functionality of these devices can be enhanced with the incorporation of such features as lenses, heaters, and valves.

Micralyne has expertise in both surface micromachining and bulk micromachining:
Surface Micromachining
This technique involves the building up of layers on the surface of the substrate, utilizing low stress films such as oxide and nitride while etching out the sacrificial layer such as amorphous silicon
Bulk Micromachining
This technique involves etching away the bulk of the silicon wafer to create the desired microstructures. The etching of the silicon occurs by using either a dry etch (DRIE) or a wet (KOH or TMAH) etch for more of an anisotropic etch

Micralyne also has the capabilities to post process CMOS wafers, which integrate circuitry with MEMS technology.

Micralyne uses a variety of substrates ranging from silicon, ceramic, SOI to glass substrates.

Some examples of Micromachined MEMS devices are:
MEMS Microphones
MEMS optical switch systems
Silicon optical bench systems
Laser diode submounts
Implantable drug delivery systems
MEMS Sensors (gas, water, etc.)
Print head nozzles
IC chip testing
Lab-on-a-chip