Thin Film Deposition

Thin Film Gold Metallization

Micralyne’s thin film expertise involves the fabrication of devices (such as solder, resistors and waveguides) with thin film layers of materials that vary in thickness from a few hundred angstroms to tens of microns.

PVD Coatings

• Standard metallization processes for low stress films, barriers, reflective surfaces, masking layers and thin film resistors
• Engineers use three-target sputtering systems to provide consistent thin film quality and access to custom adhesion, barrier and conductive layers. Patterning is done to match customer specifications using wet chemical etch or liftoff techniques

Plated Au-Sn Solder

• Micralyne offers a patented process for electroplating of AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), in patterned or unpatterned shapes onto metallized substrates at virtually any thickness

PECVD Dielectrics

• Slab, ridge and buried core waveguides with core dimensions of 3 – 8 microns using PECVD oxynitrides for index control

Thin Film Substrates

• Micralyne has the capabilities to work with a variety of substrate materials including silicon, SOI, ceramics and glass

Data Sheet Download:

Thin Film Metallization Systems
Plated Au-Sn Solder

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