|
 |
|
Thin Film Gold Metallization |
Micralyne's
thin film expertise involves the fabrication of devices (such as solder, resistors and waveguides) with
thin film layers of materials that vary in thickness from a few hundred angstroms to tens of microns.
PVD Coatings
|
|
• |
Standard metallization processes for low stress films, barriers, reflective surfaces, masking layers and thin film resistors |
|
|
• |
Engineers use three-target sputtering
systems to provide consistent thin film
quality and access to custom adhesion, barrier
and conductive layers. Patterning is done to
match customer specifications using wet chemical
etch or liftoff techniques |
|
|
• |
Micralyne offers a patented process for electroplating of AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), in patterned or unpatterned shapes onto metallized substrates at virtually any thickness |
PECVD Dielectrics
|
|
• |
Slab, ridge and buried core waveguides with core dimensions of 3 – 8 microns using PECVD oxynitrides for index control
|
Thin Film Substrates
|
|
• |
Micralyne has the capabilities to work with a variety of substrate materials including silicon, SOI, ceramics and glass |
Data Sheet Download:
Thin Film Metallization Systems
Plated Au-Sn Solder
