6-Inch MEMS Processing Capabilities

Up to 6inch MEMS ProcessingMEMS are transforming the world, changing the lives of our customers and our customers’ customers.

While we have extensive experience in both standard and non-standard substrates, we also work with the most cutting-edge substrates, including silicon, glass, polymers, and diamonds.

Micralyne has a number of expert MEMS capabilities for the microfabrication, packaging, assembly and characterization of MEMS devices it supplies for its customers.

Our 4 inch to 6 inch MEMS capabilities include:

MEMS Lithography

  • Mask aligners with contact, proximity & vacuum mode
  • Back to front alignment capability using IR and optics
  • Cassette to cassette loading
  • Tracks for automatic coating/developing
  • Manual coaters and developers

MEMS Metal deposition

MEMS Plasma deposition

  • Batch top PECVD (oxide/nitride/oxynitride/amorphous silicon)
  • Dual wafer load lock system
  • Dual frequency capability of oxide and nitride

MEMS Plasma etching

  • Batch top etching of nitride and oxide
  • Cassette to cassette oxide etchers

MEMS Deep Reactive Ion Etching

Furnaces

  • Pyrogenic thermal oxidation
  • Annealing

MEMS Wet etching

  • Anistotropic etching of silicon, dielectrics, metal films, glass

MEMS Electroplating

Bonding

  • Glass-glass fusion bonding
  • Silicon-silicon fusion bonding
  • Glass-silicon anodic bonding
  • AuSn solder eutectic bonding

Glass

  • Borofloat, 0211, Quartz, Pyrex, Fused Silica, Sapphire

MEMS Substrates

  • 4” or 6” silicon, SOI and 8″ MEMS
  • 4” or 6” (round or square) Glass
  • Miscellaneous substrates of odd sizes
  • 4” and 6” wafers

Silicon

  • Standard, Single and Double SOI, Epitaxial

Dicing

  • Standard silicon and glass dicing
  • Quartz and alumina dicing
  • Silicon-glass stacked dicing
  • Glass-glass stacked dicing

Wire Bonding

  • Manual and automated wire bonding
    (dies to package, dies to submount, flex cables)
  • High-speed automatic wedge Al/Au

MEMS Characterization

  • SEM (Scanning Electron Microscope) with x-ray analysis
  • Thin film stress measurement with thermal cycling capability
  • Line width measurement
  • Sheet resistance measurement
  • Optical profiler using white light interferometer
  • Surface profilers
  • Film thickness measurements
  • CV measurements
  • Wire bond pull test
  • Electrical test – probe station
  • Real time measure and data acquisition

Minimum Wafer thicknesses

  • 4″ (100um)
  • 6″ (380um)

Miscellaneous

  • Alumina, Piezoelectric Crystals, Polymers, Ceramic, Diamond, AlN

How can you access up to 6 inch creative MEMS design and quality volume manufacturing at a competitive cost?

Focus on development and prototyping in a lower-cost environment first. Develop your solution on our complete in-house 4” and 6” lines. When your path to market is finalized, we can transfer the solution to our partners for scale up to 8” wafers.

How do you get started?

Do you want to harness the capabilities of 4-6” wafer processing immediately? Contact Us today to get started.

Read more details about MEMS Assembly & Test at Micralyne.