Micralyne Scientist Wins Second Award for AuSn Solder Research

July 13, 2004

Edmonton, Alberta, July 13, 2004 – Micralyne Inc., a market-leading MEMS manufacturer, announced today that Project Scientist, Dr. Siamak Akhlaghi, has received a Silver Medal Award from the American Electroplaters and Surface Finishers Society (AESF). Dr. Akhlaghi was presented the Abner Brenner Award, for the second straight year, for the best paper published in the Plating and Surface Finishing Journal during the year 2003.

The general topic of Dr. Akhlaghi’s paper is the electroplating of gold-tin eutectic solders, which are used for packaging microelectronic and optoelectronic devices because of their excellent thermal and mechanical properties and relatively low melting or reflow temperature. This type of electroplating is a cost effective alternative to current commercial solder deposition processes, such as evaporation and more flexible in terms of placement compared to solder preforms.

The award winning paper, Effect of Processing Parameters on the Electroplating of Au-Sn Solders, focuses specifically on a co-electroplating process that has been developed for depositing Au/Sn alloys, from a slightly acidic, chloride-based solution using pulsed currents, onto patterned or blanket metallized ceramic and semiconductor substrates.

The electroplating solution stability along with the effect of agitation and temperature on the electroplating process was studied. The useful lifetime of the solution is about three days. In addition, deposit uniformity could be improved through solution agitation, although too much agitation reduced the Sn content and increased the surface roughness in the deposit. Moreover, it was observed that increasing the solution temperature to above 35 °C was not beneficial, due primarily to an increase in the oxidation rate of Sn in solution, which, in turn, reduced the amount of Sn available for plating. Both agitation and increased bath temperatures proved to be beneficial in terms of increasing plating rates.

Along with this prestigious award, Dr. Akhlaghi’s work in the area of AuSn plating is generating orders from several customers for use in microelectronics and other packaging. Details on Micralyne’s Plated AuSn Solder offering can be found on its website at www.micralyne.com or via a Micralyne representative at 780-431-4400.

To read Dr. Akhlaghi’s paper click here.

About Micralyne
Micralyne develops and manufactures microfabricated and MEMS (Micro-Electro-Mechanical-Systems)-based products. Micralyne is one of the largest independent companies in the world that manufactures MEMS in high volumes. MEMS technology is built on the premise of making industrial components smaller, faster and less expensive and facilitates radical improvements in the miniaturization of electronic and mechanical devices. These types of devices are used in many industries including communications, automotive, aerospace, and life sciences. More specifically, Micralyne’s micron-scale solutions (i.e. 1000 microns = 1 millimetre) are found in automotive emission sensors, optical switching technology in telecommunication networks, lab-on-a-chip devices for drug discovery, and commercial press equipment for printing today’s most popular magazines. Micralyne is a profitable and growing company headquartered in Edmonton, Alberta, Canada.

For further information contact:
Mr. Bruce Alton
Vice President Marketing & Business Development
Micralyne Inc.
1911 – 94 Street
Edmonton, Alberta
Canada T6N 1E6
Phone: 780-431-4400
balton@micralyne.com