Micralyne CEO Nancy Fares Addresses MEMS Fabrication in a Fabless and Fablite World at Sensors Expo & Conference 2011

June 06, 2011

Company showcases capabilities in wafer-level bonding, Via technology, DRIE and more at Booth 208

Sensors Expo 2011
Booth 208

EDMONTON, Alberta — Micralyne, Inc., a leading pure-play micro-electromechanical systems (MEMS) foundry serving high-performance biomedical, telecommunications and industrial markets, will be well represented at this week’s Sensors Expo & Conference. Micralyne CEO Nancy Fares, who joined the company last year from Texas Instruments—where she led the drive to secure 95% market share for the DLP Cinema® and DLP® HDTV business units—will explore one of the hottest themes in microfabrication: the challenges and opportunities in adapting infrastructure to a fabless and fablite world. Ms. Fares will join MEMS device-makers and end-users in the MEMS Industry Group panel, “Adapting Infrastructure to a Fabless and Fablite World,” during the Sensors Expo pre-conference symposium, “MEMS Commercialization Opportunities for Systems and Products,” June 6, 2011, 3:30-4:30 p.m.

“Microfabrication of High Performance Inertial Sensor Using WLP Technology”

“With growing ranks of MEMS device-makers designing pressure, gas and thermal-imaging sensors, as well as micro-fluidics and optical sensors, the fabless-fablite approach presents an attractive model for companies commercializing their products for specialized markets,” said Nancy Fares, CEO of Micralyne. “Outsourcing microfabrication, from development and packaging to assembly and characterization of MEMS devices, frees designers to do what they do best: move IP from conceptualization to commercialization with a trusted foundry partner.”

Micralyne’s sensors experts will address Wafer Level Packaging (WLP) techniques for high-precision MEMS inertial sensors in their presentation, “Microfabrication of High Performance Inertial Sensor Using WLP Technology,” June 8, 11:00-11:40 a.m. They will present the ways in which poly-filled through silicon vias, multi-wafer bonding and package-pressure aging can increase inertial-sensor precision 1000x over competitive solutions.

For More Information

Micralyne will showcase MEMS technologies such as DRIE techniques, high-resolution lithography, WLP and Through Silicon Via (TSV) at Sensors Expo Booth 208, Donald E. Stephens Convention Center in Rosemont, IL, June 7-8.

For more information on Sensors Expo & Conference, please visit: http://www.sensorsmag.com/sensors-expo. For more information on Micralyne, please visit: www.micralyne.com or email: sales@micralyne.com.

About Micralyne

Micralyne is one of the world’s largest independent MEMS foundries. Headquartered in Edmonton, Alberta, Canada, Micralyne serves a diverse customer base, from innovative Fortune 100 companies to high-tech start-ups. With a proven MEMS manufacturing track record and a rich development history dating back to 1982, Micralyne has helped to pioneer the MEMS industry by creating some of the world’s smallest mechanical structures for leading corporations.

Micralyne and the Micralyne logo are registered trademarks of Micralyne, Inc. All other product and company names are trademarks or registered trademarks of their respective holders.

Contacts

Micralyne
Jim Ramsden, 780-431-4407
jramsden[at]micralyne.com
or
Vetrano Communications
Maria Vetrano, +617-876-2770
pr_info[at]vetrano.com