Micralyne Presents Gold-Tin Solder Bonding Process for Wafer-Level Packaging
May 29, 2009
Edmonton, Alberta, May 29, 2009 – Micralyne Inc., a growing MEMS and microfluidics foundry, announced today that Project Engineer, Mr. Dean Spicer, will be speaking next week at The 2009 IEEE International Interconnect Technology Conference (IITC) on Tuesday, June 2.
The attendees of the twelfth IITC conference, located in Sapporo, Hokkaido, Japan, will take in Mr. Spicer’s poster session from 1.30 p.m. until 3:30 p.m. at the Royton Sapporo Hotel, Royton Hall A/B.
Spicer will be presenting on the topic Thin-Layer Au-Sn Solder Bonding Process for Wafer-Level Packaging, Electrical Interconnects and MEMS Applications. The results being presented were obtained within a development program for a MEMS-based memory device. Wafer-to-wafer bonding is a key process in MEMS wafer-level packaging (WLP).
The developed MEMS wafer bonding process utilizes gold-tin solder electroplating and provides liquid-proof sealing and multiple reliable electrical connections between the bonded wafers. The wafer bond can withstand 300ÂºC and features a thin bond line (2-3 ?m), high bond strength, excellent bond gap control, and low stress due to small amount of bonding material.
To learn more, please download the White Paper: Thin-Layer Au-Sn Solder Bonding Process
Micralyne is one of the world’s largest, independent, MEMS development and MEMS manufacturing service providers. With its headquarters in Edmonton, Alberta, Canada, Micralyne services a diverse customer base with applications in, automotive sensors for control systems, lab-on-a-chip devices for drug discovery, MEMS optical switching and attenuation technology in telecommunication networks, optical light valves for computer-to-print applications and sensors for a variety of applications such as oil and gas exploration and chemical analysis.
For further information contact:
1911 – 94 Street
Canada T6N 1E6