Micralyne Selects SUSS for Wafer Bonding Production
July 05, 2006
Edmonton, Alberta, July 5, 2006 – Micralyne Inc., a world leader in the manufacture of MEMS components, announced today it has purchased the SB6e wafer bonder and BA6 aligner system from SUSS MicroTec Inc., a leading supplier of precision manufacturing and test equipment for the semiconductor and emerging markets.
Due to increasing production demands over the past year, Micralyne has doubled its employee base and added additional working shifts at its 50,000 sq. ft. plant. As part of this ramp up to volume production Micralyne is investing in facility expansion and capital equipment, such as adding aligned wafer bonding capacity.
“The growth in our foundry business makes capital equipment purchases more critical than ever. After careful evaluation of equipment suppliers, we chose SUSS for our production wafer bonding needs. SUSS has the refined equipment tool set and technical support infrastructure needed by MEMS chip manufacturers today,” said Chris Lumb, President and CEO of Micralyne. “We are seeing strong chip demand in several markets including life sciences, optical networking, and a variety of sensor applications.”
“Micralyne is clearly a leader in MEMS development and manufacturing. The MEMS foundry business is an increasingly growing market segment for SUSS as more and more companies go fabless, and we are delighted to have been selected by them for their wafer bonding production needs”; said Michael Kipp, President, Wafer Bonder Division, SUSS MicroTec, Waterbury, Vermont, USA.
The SB6e is a semi-automatic, computer controlled, stand-alone substrate bonder. Featuring a rigid vacuum/pressure chamber, upper and lower independent heaters & wafer stack loading arm, the SB6e represents the latest generation of SUSS substrate bonders. Combined with the BA6 SUSS Bond aligner the SB6e provides superior post bond alignment, force and temperature uniformity, and pressure control capabilities for Wafer Level Packaging of MEMS.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders, probe systems and now equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visitÂ www.suss.com
Micralyne is one of the world’s largest independent MEMS (Micro-Electro-Mechanical-Systems) foundries. As an industry leader, Micralyne offers unparalleled MEMS product development and commercial volume manufacturing. Thanks to a unique blend of highly responsive service from a knowledgeable team and a track record of manufacturing success, Micralyne offers its customers efficient development times and quality products. MEMS technology is built on the premise of making industrial components smaller, faster and less expensive. Micralyne’s micron-scale solutions (i.e. 1000 microns = 1 millimetre) are found in automotive sensors for control systems, optical switching technology in telecommunication networks, lab-on-a-chip devices for drug discovery, and commercial pre-press equipment for printing today’s most popular magazines. These types of devices are used in many industries including communications, transportation, energy, and life sciences. Micralyne’s headquarters and state-of-the-art manufacturing facility is located in Edmonton, Alberta, Canada.
For further information contact:
Mr. Chris Lumb
President & CEO
1911 – 94 Street
Canada T6N 1E6