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Micralyne Newslyne - August 2008
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Welcome to the August 2008 Edition of Newslyne, Micralyne's quarterly e-newsletter. In this edition learn about Electroplating of AuSn eutectic solder for MEMS packaging, process interface and recent Micralyne news.

Micralyne a finalist for two prestigious awards
CEO of MEMS Manufacturer is up for the title of Ernst & Young Entrepreneur of the Year

(click here for details)

CEO of MEMS Manufacturer is up for the title of Ernst & Young Entrepreneur of the Year


Contents - August 2008

:: Message from the CEO
:: Electroplating of AuSn eutectic solder for MEMS packaging
:: Micralyne News & Events


Message from the CEO

Mr. Chris Lumb, President & CEO, Micralyne
Mr. Chris Lumb, President & CEO, Micralyne
The Design - Process Interface: is the Boundary Distinct?

One of the challenges you'll have to address if you use an external fab to make your parts - and most MEMS product companies do use external fabs - is to get the interaction between product and process right. This should be easy, right? You, the product designer, state your requirements, and the fab tells you whether it has processes that can deliver your product to you.
::Continued...

- Chris Lumb, President & CEO, Micralyne -


Electroplating of AuSn eutectic solder for MEMS packaging

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In the drive to reduce packaging cost, wafer level packaging has become an important part of MEMS manufacturing. There are different methods for performing wafer level packaging such as fusion bonding, anodic bonding andeutectic bonding to name a few. Gold-tin (AuSn) solder is routinely used for eutectic bonding. AuSn eutectic solders are unique material for wafer level packaging, mainly due to their excellent thermal properties, mechanical strength and relatively low melting temperature, which makes them an attractive choice for hermetic sealing.

Application methods for deposition of AuSn solders for MEMS wafer level packaging is mostly concentrated on costly PVD methods such as evaporation and sputtering techniques. However, electroplating is an economic, alternate deposition option that allows for high placement and composition accuracy. Micralyne has exclusive right to a patented process for electroplating of AuSn solder alloy, at compositions from 10 to 40 Sn (wt%), including commercially important Au-20Sn eutectic composition. Visit www.goldtinsolder.com for more information on Micralyne's gold-tin solder service. ::Continued...

- By Siamak Akhlaghi and Kar Mun Cheng, Micralyne Inc. -



MEMS News, Events & Resources

MEMS Foundry Continues Support of CMC Microsystems TEXPO Awards
Micralyne Inc., a world leading MEMS Foundry, was pleased to announce its continued support for the Micralyne Microsystems Design Award presented at the CMC Microsystems Annual Symposium. Micralyne has supported the TEXPO student competition awards since 2001.
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CEO of MEMS Manufacturer is up for the title of Ernst & Young Entrepreneur of the Year
Micralyne Inc.'s Chris Lumb, CEO of the leading independent MEMS manufacturer, has been selected as a finalist for the Ernst & Young Entrepreneur Of The Year Award for 2008 in the category of Biotechnology & Technology.
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MEMS Foundry makes the cut for the 2008 EuroAsia IC Industry Awards
Micralyne Inc., a world leading MEMS foundry, has been selected as a finalist for the EuroAsia IC Industry Awards in the category of Foundry of the Year.
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Employees of MEMS Manufacturer Give to China Earthquake Relief
Employees of Micralyne Inc. banded together to raise funds for China Earthquake Relief through World Vision Canada.
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Contact Information: Micralyne Inc.
1911-94 Street, Edmonton, Alberta, Canada, T6N 1E6
Phone: 1.780.431.4400 Fax: 1.780.431.4422
Email: info(at)micralyne.com