Thin Film Sputtering
Custom Thin Film Metal Sputtering
Custom thin film metallization consists of sputtering metal coatings with patterns made to customer specifications. Micralyne routinely deposits a wide variety of films on many different substrate materials (silicon, glass, alumina etc.). Engineers use tri-target sputtering systems to provide consistent film quality and access to custom adhesion, barrier and conductive layers.
The target materials available at Micralyne include gold, platinum, silver, aluminum (and alloys), titanium, tungsten (and alloys), tantalum, chromium, and nickel alloys to name a few. Depending on the material selected, thin film sputtered layers can range from 5 nanometers for adhesion layers to microns for conduction layers. Patterning is done to match customer specifications using wet chemical etch or liftoff techniques.
Micralyne’s experienced engineering staff (over 25 years) can provide assistance in choosing substrates and sputtering metallization stacks at the inception of a project. If difficulties are encountered, the engineering team will also help troubleshoot a customer’s process.
Thin Film Quality
Micralyne’s quality assurance program is registered with ISO standards and will meet most existing military and aerospace requirements.
Silicon, SOI, Glass, Quartz, Sapphire, Diamond, AlN, Alumina, Other
Gold (Au), Copper (Cu), Aluminum (Al)
Titanium/Tungsten (TiW), Platinum (Pt), Molybdenum (Mo), Nickel Copper (NiCu), Other
Sputtering Adhesion Layers
Chromium (Cr), Titanium (Ti), Titanium/Tungsten (TiW), Other
Gold Tin (AuSn) – electroplated
Tantalum Nitride (TaN)
Metallization Design Guidelines
Micralyne can pattern on both the top and bottom sides of a substrate. Patterning can be done with a shadow mask, a wet etch, or a liftoff procedure depending on the specific metal stack and design requirements.
Line resolution and dimensional tolerance varies widely depending on the sputtered metal thickness, the metal stack and the patterning procedure used.
Please contact us for more information on Thin Film Sputtering and metallization systems specific to your design.