MicraSilQ Wafer Level Packaging Platform

MicraSilQ™ (pronounced Micra-silk) wafer level packaging (WLP) process platform technology for MEMS devices provides an all-in-one customer solution integrating wafer level fabrication, hermetic packaging and through silicon via (TSV) architecture. The MicraSilQ™ established design kit reduces initial development cost, ultimate manufacturing component cost, footprint, thickness and weight, while simultaneously providing improved electrical performance, reliability, and extensibility into 3D IC designs.

MicraSilQ™ can be used for a variety of inertial sensors. Features include:

  • Insulated Through Silicon Vias (TSV) –  polysilicon filled
  • Thick silicon device layer (60 microns standard) for high comb finger capacitance
  • Lead-free solder ball grid array
  • Wafer level bonding processes optimized for getter film activation and hermetic sealing

MicraSilQ™ has proven to be a cost-effective solution for applications requiring high accuracy, low noise mechanical sensing, for devices operating across wide frequency ranges, and for components requiring high vacuum encapsulation.

Download our Whitepaper: Advanced WLP Platform for High-Performance MEMS to learn more.

Ready to Design? Request our MicraSilQ™ Wafer Level Packaging Design Kit