Wafer Level Packaging (WLP)

wafer level packaging photoWafer Level Packaging (WLP) is vital to the future of MEMS devices. Encapsulating and protecting the functional MEMS devices at the wafer level increases yield. Wafer level encapsulation lowers your final cost of the MEMS device and produces more reliable, robust devices.

Micralyne has developed a WLP platform that can be used for a variety of microdevices. This platform includes:

  • Insulated Through Silicon Vias (TSV) Deep Etched and Polysilicon-filled
  • Electrical contacts between the MEMS
  • Die and macroscale device
  • Wafer level bonding processes optimized for getter films and wafer level testing

These technologies provide customers with controlled pressure or high vacuum sealing, low and high temperature bonding options, and hermetic sealed and singulated die at the wafer-level.

Contact us to find out more about our Wafer Level Packaging technology.