Teledyne Micralyne provides a variety of capabilities for back-end wafer processing. We provide wafer services for common materials such as silicon, glass and quartz, as well as more exotic substrates like alumina, sapphire, diamond and AlN.
Teledyne Micralyne also offers a variety of wafer bonding techniques for creating multi-wafer stacks and wafer-level packaging. Other back-end capabilities include wafer grind and polish, wafer dicing. Learn about Teledyne DALSA’s wafer processing capabilities.