Teledyne Micralyne provides a variety of capabilities for back-end wafer processing. We provide wafer services for common materials such as silicon, glass and quartz, as well as more exotic substrates like alumina, sapphire, diamond and AlN.

Teledyne Micralyne also offers a variety of wafer bonding techniques for creating multi-wafer stacks and wafer-level packaging.  Other back-end capabilities include wafer grind and polish, wafer dicing. Learn about Teledyne DALSA’s wafer processing capabilities.

Wafer Bonding

  • Aligned bonding: 3 µm alignment accuracy
  • Bonding can be performed in a controlled environment (vacuum capability of 5.5 x 10-5 mbar, maximum tool force is 20 kN.

Anodic Bonding

  • Silicon – pyrex

Fusion Bonding

  • Glass-glass
  • Silicon-silicon
  • Silicon-oxide

Eutectic Bonding

  • AuSn
  • AuSi


  • Conventional diamond blade dicing for silicon or glass (single, double or triple stack), silicon/glass stack, and ceramic
  • Standard silicon dicing, 4″ & 6″
  • Standard glass dicing up to 6″
  • Stealth laser dicing
  • Silicon wafer grinding (± 0.5 µm)
  • Chemical mechanical polish (Si and SiO2 )
  • Wafer laser coring
  • Quartz dicing
  • Alumina dicing


Ready to discuss project needs? Call us on 1.780.431.4400 or email us at [email protected]