February 7, 2019 — CMC Microsystems is working with Micralyne to manufacture interposer-based modules incorporating semiconductor wafers with Through Silicon Vias (TSVs), the key interconnect of silicon interposer technologies.

“Micralyne is pleased to provide this technology based on its successful wafer-level packaging, MicraSilQ™ platform,” says Ian Roane, President and CEO of Micralyne. “Building off Micralyne’s market-proven TSVs, the wide variety of applications for these interposer modules will allow us to find and serve new markets.”

Read the full announcement here.

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