Reduce Development Costs and Accelerate Time-to-Market
Teledyne Micralyne’s MEMS Technology Platforms provide a modular approach to MEMS design and enable a semi-custom device implementation. By standardizing specific process steps and structures, Teledyne Micralyne reduces the need to create a new process for each design. Customers control the technical content and specify the device structure, functionality, size and characteristics. We provide standard flows to implement items like Silicon on Insulator (SOI) processes, Wafer Level Packaging (WLP) and Through Silicon Vias (TSV).
In addition to the available platforms at Teledyne Micralyne, our sister company, Teledyne DALSA, offers platforms to speed product design and reduce cost. Learn more about Teledyne DALSA’s platforms.
