Wafer processing
Teledyne MEMS provides a variety of capabilities for back-end wafer processing.
A wide range of materials and bonding techniques gives you more options for new innovations.
Substrates
We provide wafer services for common materials such as silicon, glass and quartz, as well as more exotic substrates. We also offer a variety of wafer bonding techniques for creating multi-wafer stacks and wafer-level packaging as well as back-end capabilities such as wafer grind and polish and wafer dicing.
- Silicon (6″ wafers) – standard, single and double SOI, epitaxial
- Glass & silica – Borofloat®, Corning 0211 and Pyrex®, quartz and fused silica
- Miscellaneous – alumina/sapphire, piezoelectric crystals, ceramic, diamond, aluminum nitride
Bonding
Wafer Bonding
- Aligned bonding: 3 µm alignment accuracy
- Controlled environment (vacuum capability of 5.5 x 10-5 mbar, maximum tool force is 20 kN)
- Anodic Bonding
- Silicon – pyrex
Fusion Bonding
- Glass-glass
- Silicon-silicon
- Silicon-oxide
- Eutectic Bonding
- AuSn
- AuSi
Dicing
- Conventional diamond blade dicing for silicon or glass (single, double or triple stack), Silicon/glass stack, and ceramic
- Standard silicon dicing, 4″ & 6″
- Standard glass dicing up to 6″
- Stealth laser dicing
- Silicon wafer grinding (± 0.5 µm)
- Chemical mechanical polish (Si and SiO2 )
- Wafer laser coring
- Quartz dicing
- Alumina dicing
Teledyne MEMS Capabilities
We blend MEMS applications experts together with process performance champions to design process flows for robust, cost-effective fabrication to match customer requirements. Our project teams strive for deep insights to their customers’ needs and close communications throughout the relationship.
Do you have any questions?
Select Teledyne as your partner to move your MEMS device from concept to mass production.
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